MURMUR / system
DEVELOPMENT
MURMUR / DEVELOPMENT
Build. Test. Record. Revise.
SYSTEM 001 is being developed as a physical garment and hardware system, not a render-first product catalogue. The public development path follows the work required to turn the architecture into a reliable wearable prototype.
Current build guide / DG03
The 19 September 2026 edition contains 88 pages, preserves the approved design direction and adds 13 workshop instruction pages. The companion toolkit contains the editable guide, a 67-activity offline tracker, a five-input Pico 2 diagnostic and the software test reports.
OPEN THE DG03 BUILD GUIDE AND TOOLKIT →
Begin at page 76 for the first workshop session: identify the sample, prove a seam coupon, test the five passive inputs on an otherwise disconnected board, measure one connected module and export the record.
01 / Pattern & fit
Validate the shell block, hood/cowl geometry, sleeve mobility, drape and service access in toile before final technical fabric.
02 / Loaded carrier
Test the removable carrier with representative masses before committing electronics placement. Weight distribution, movement and comfort must work before feature density increases.
03 / Routing & thermal
Validate cable paths, strain relief, access, antenna clear zones, power isolation and thermal behaviour under actual wear conditions.
04 / Electronics integration
Bench-test the trusted local core and serviceable observer modules independently, then integrate only after each subsystem has a known pass condition.
05 / Wear testing
Test movement, don/doff, module access, loaded comfort, fault recovery and repeatability. Record failures rather than hiding them.
06 / Production decision
Freeze final textiles, hardware, sizing and production geometry only after prototype evidence supports the decision.
DG03 release record
The document was checked at 88 pages with 88 bookmarks. The input diagnostic passed 12 host unit tests; the tracker passed 15 browser checks. These are document and software results, not on-board, garment or RF acceptance. Physical activities begin unrecorded.
The native full-size C5A/C.4 cutting master is not included. Guide illustrations and inherited piece envelopes do not replace native cutting contours. The new instructions allow seam coupons, measured module mock-ups and identified-board input checks to proceed without inventing that missing geometry.
Generated imagery is used to communicate design intent. Claims about fit, RF behaviour, sensing, thermal performance or durability require physical testing.